MIGDAL HAEMEK, Israel, August 19, 2015

Jordan Valley announces the selection of their advanced JVX7300RF-W, by a world leading process equipment manufacturer. The tool was selected following extensive evaluation of tool capability, performance and productivity for development and customers' demonstration of advanced wafer level packaging and thin-film applications.

Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received an order from a market-leading equipment manufacturer, selecting the new JVX7300RF-W metrology system for advanced process development and control.

The JVX7300RF-W system offers invaluable in-line metrology combining both small spot XRF and first principle XRR and providing solutions for multilayer complex 2D and 3D metal stacks, as well as ultra-thin layers (

The JVX7300RF-W delivers high ROI and low CoO for its inline metrology of next generation Wafer Level Packaging (WLP) advanced micro-bump process development and control, allowing high throughput non-destructive thickness and composition measurements.

JVX7300RF-W is the successor to the production proven JVX6200iRF with extended capabilities and significant productivity improvements. The 7300RF-W allows metrology on smaller features necessary to adhere to the industry roadmaps and the WLP segment's unique needs among others.

"This order marks the true need of JVX7300RF-W for the development and control for advanced WLP and other thin-films" stated Asaf Shlomo, Jordan Valley's Product Marketing Manager. "This engagement from a leading equipment manufacturer is further acknowledgement of the high value of the JVX7300RF-W tool to provide advanced WLP and plating process metrology solutions," added Shlomo.

Isaac Mazor, Jordan Valley CEO, noted, "We are proud of this win, to be part of center of excellence of another leading supplier, where we will demo our tool as part of advanced tool set for our mutual customers."

About the JVX7300RF-W production metrology tool

The JVX7300RF-W is a production worthy X-ray metrology tool combining small-spot XRF and XRR measurement channels. The tool targets both FEOL applications for nodes at 20nm and lower, and advanced WLP manufacturing. The tool is configured for full fab automation and is SEMI S2/S8 and CE certified.

About Jordan Valley Semiconductors Ltd

Jordan Valley Semiconductors (JVS) is the leader in X-ray metrology and defect detection tools for the semiconductor industry. Jordan Valley's tools are fully automated non-contacting and non-destructive tools designed for production control on patterned or blanket wafers.

The company offers the semiconductor industry the most comprehensive portfolio of advanced metrology and defect inspection tools, based on X-ray technologies such as XRR (X-ray reflectometry), XRF (X-ray fluorescence), XRD (X-ray diffraction) and others.

Jordan Valley's investors include Clal Industries and Investments Ltd. (TASE:CII), Intel Capital (INTC) and Elron Electronics Industries Ltd. (ELRN.TA). With headquarters in Migdal Haemek, Israel, the company has subsidiaries in Durham UK, Austin TX USA, Hsin-Chu Taiwan, Suwon Korea and other offices and sales representatives worldwide.

For more information:
Asaf Shlomo
Product Marketing Manager
Tel: +972-4654-3666
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